| 000 | 00812nai a2200205Ia 4500 | ||
|---|---|---|---|
| 003 | IN-BaIIA | ||
| 008 | 211028c9999 xx s 000 0 eng d | ||
| 022 | _a2156-3950 (Print) | ||
| 022 | _a2156-3985 (Online) | ||
| 040 | _cIIA Library | ||
| 245 | 0 |
_aIEEE Transactions on Components, Packaging and Manufacturing Technology _h[eJournal] |
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| 260 |
_aNew York, USA _bThe Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
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| 310 | _aMonthly | ||
| 362 | _a1(1); 2011 - Present | ||
| 521 | _bSubscribed through National Knowledge Resource Consortium (NKRC) | ||
| 650 | _a Engineered Materials, Dielectrics and Plasmas | ||
| 650 | _aComponents, Circuits, Devices and Systems | ||
| 856 |
_uhttps://ieeexplore.ieee.org/servlet/opac?punumber=5503870 _yClick Here to Access eJournal |
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| 942 | _cEJ | ||
| 999 |
_c34644 _d34644 |
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