TY  - DATA
TI  - IEEE Transactions on Components, Packaging and Manufacturing Technology
SN  - 2156-3950
CY  - New York, USA
PB  - The Institute of Electrical and Electronics Engineers, Inc. (IEEE)
KW  -  Engineered Materials, Dielectrics and Plasmas
KW  - Components, Circuits, Devices and Systems
N1  - Subscribed through National Knowledge Resource Consortium (NKRC)
UR  - https://ieeexplore.ieee.org/servlet/opac?punumber=5503870
ER  -