TY  - DATA
TI  - IEEE Transactions on Advanced Packaging
SN  - 1521-3323
CY  - New York, USA
PB  - The Institute of Electrical and Electronics Engineers, Inc. (IEEE)
KW  - Components, Circuits, Devices and Systems
N1  - Subscribed through National Knowledge Resource Consortium (NKRC)
UR  - https://ieeexplore.ieee.org/servlet/opac?punumber=6040
ER  -