TY  - BOOK
AU  - Kullberg, Richard, ed.
TI  - Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS and Nanodevices VIII
T2  - Proceedings of SPIE; V. 7206
SN  - 9780819474520 (Print)
PY  - 2009///
CY  - Washington, USA
PB  - SPIE
UR  - https://www.spiedigitallibrary.org/conference-proceedings-of-spie/7206
ER  -