TY  - BOOK
AU  - Kullberg, Richard, ed.
TI  - Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS and Nanodevices IX
T2  - Proceedings of SPIE; V. 7592
SN  - 9780819479884 (Print)
PY  - 2010///
CY  - Washington, USA
PB  - SPIE
UR  - https://www.spiedigitallibrary.org/conference-proceedings-of-spie/7592
ER  -